Multi - chip in a package technology

When a designer has a system that is designed with chips with differing voltages, currents, frequencies and special characteristics it is difficult to integrate the system for cost or size reduction. In this case the usual approach is a motherboard - daughter board combination. ( Usually, but not always). Recently it appears that designers are turning to multi-chip in a package technology. In this case a package is used which has die in it assembled in a vertical configuration or a side by side combination. Properly done , this can be a powerful way of getting the job done in a shorter time with less cost than a difficult integration approach. The design of the multi-chip configuration is the key. Some parameters to be considered seriously are temperature effects, parasitic connections, grounding, and frequency performance. Signal Processing Group Inc., is offering a multi-chip in a package design and assembly service for interested users. SPG website is located at http://www.signalpro.biz.